Description
General lead-free soldering in the electronics sector, for dip tinning, for galvanic tinning and for model casting.


high-purity quality from first melting
General lead-free soldering in the electronics sector, for dip tinning, for galvanic tinning and for model casting.
| Verpackungseinheit | 15,0 kg |
|---|---|
| Gebindegröße | |
| Bleihaltig / Bleifrei | bleifrei |
| Legierung |