Solder wire “Massiv” Sn96.2Ag3.8

Lead free refill solder for automatic feeding in selective soldering systems

kg
SKU: 148930491 Category:

Description

In addition to the copper-containing alloy Sn95.5Ag3.8Cu0.7, we recommend the copper free refill solder Sn96.2Ag3.8 for the refill process. As this solder mixes with the existing solder and Cu enrichments in the solder bath to form the alloy SAC387, the soldering properties of the base solder remain unaffected.

Additional information

Verpackungseinheit

24,0 kg
Gebindegröße

Durchmesser / Vierkant

3,000 mm
Bleihaltig / Bleifrei

bleifrei
Legierung

Sicherheitsdatenblatt