Description
Lead-free solder alloy for the tinning of enamelled copper wires in dip and selective soldering systems at high soldering temperatures above 350 °C (e.g. soldering on coil bodies in transformer construction). The solder bath achieves a longer service life due to the lower copper input (“pre-saturation” of the solder with copper). Copper leaching during the soldering process is significantly reduced compared to standard nickel-free solders.