Description
Lead-free soft solder for tinning enamelled copper wires in dip and selective soldering systems at soldering temperatures of up to 500 °C. (e.g. in coil production or transformer construction). Due to the Ni content of ISO-Tin® “HTL-Sn100Ni+ REFILL”, copper alloying is significantly reduced. This solder contains no phosphorus. ISO-Tin® “HTL-Sn100Ni+ REFILL” is used for refilling dip solder baths to compensate for the copper enrichment caused by the leaching process.