Description
During the soldering process, copper is continuously leached from component contacts and PCB metallisation into the solder bath. The copper content in the solder quickly rises above 1 % and influences the melting temperature of the solder and therefore the soldering performance, especially in selective soldering systems. We recommend the FELDER refill solder ISO-Tin®”Sn100Ni+ High Ge-REFILL” to compensate for the introduction of copper and the simultaneous consumption of germanium in wave and selective soldering systems.