Electronic solder ISO-Tin® Sn100Ni+ REFILL

copper-free soft solder SnNi0.06Ge0.01 for wave soldering processes with high copper input

kg
SKU: 5512990046 Category:

Description

During the soldering process, copper is continuously flushed from component contacts and PCB metallisation into the solder bath. The copper content in the solder quickly rises above 1 % and influences the melting temperature of the solder and therefore the soldering performance, especially in selective soldering systems. We recommend the FELDER refill solder ISO-Tin®”Sn100Ni+ REFILL” to compensate for the copper content.

Additional information

Verpackungseinheit

15,0 kg, 20,0 kg, 3,5 kg, 4,0 kg
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Bleihaltig / Bleifrei

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