Description
Description
During the soldering process, copper is continuously flushed from component contacts and PCB metallisation into the solder bath. The copper content in the solder quickly rises above 1 % and influences the melting temperature of the solder and therefore the soldering performance, especially in selective soldering systems. We recommend the FELDER refill solder ISO-Tin®”Sn100Ni+ REFILL” to compensate for the copper content.