Description
During the soldering process, copper is continuously leached from component contacts and PCB metallisations into the solder bath. The copper content in the solder quickly increases above 1% and thus influences the melting temperature of the solder. This in turn leads to reduced wetting and can have a negative impact on soldering performance, especially in selective soldering systems. To compensate for the copper content in selective soldering systems filled with “Sn95Ag+”, we recommend the FELDER refill solder ISO-Tin® “Sn95Ag+REFILL”.