Description
During the soldering process, copper is continuously leached from component contacts and PCB metallisation into the solder bath. The copper content quickly rises above 1% and influences the melting temperature of the solder. This in turn leads to reduced wetting and influences the soldering performance, especially in selective soldering systems. To compensate for the copper content, we recommend the copper-free refill solder ISO-Tin® “Sn98Ag+REFILL” .