Description
Low-SAC electronic solder for lead-free soldering in electronic assembly production. In addition to the well-known advantages of Ni-doped solders, this alloy achieves good wetting and IPC-compliant THT through-hole filling and up to 60 % less dross formation in a normal atmosphere thanks to the addition of germanium. Compared to SnCu(Ni) alloys, the low silver addition of 0.3 % also leads to an optional reduction of the soldering temperature up to 5 °C.