HASL solder alloy ISO-Tin® HAL-Sn100Ni+ REFILL High-Ge

Description

For refilling existing lead-free HASL solder baths “HAL-Sn100Ni+”. Due to the large copper surfaces to be tinned, an increase of the copper content in the solder bath is unavoidable. The use of a copper-free refill solder significantly extends the usability of your HASL solder bath. FELDER ISO-Tin® “HAL-Sn100Ni+High-Ge-REFILL” also contains a higher germanium content to further reduce dross formation.