Description
For the soldering/tinning process, highly dielectric insulating coatings require correspondingly high burning temperatures > 500 °C. Lead-free solders tend to form excessive dross at these high solder bath temperatures. In addition, copper is massively dissolved within a very short process time and significantly reduces the current-carrying capacity of the copper wires. High-lead solders (> 85 % Pb) are currently the only alternative for soldering and tinning such magnet wires. Solder joints temperature-stable up to 200 °C.