Description
Lead-free solder alloy with nickel content for the tinning of enamelled copper wires in dip and selective soldering systems at high soldering temperatures above 350°C (e.g. soldering on coil bodies or in transformer construction).
High-temperature solder Sn96Cu4Ni
lead free alloy for use in selective and dip soldering systems at high soldering temperatures starting at 350 ° C
Additional information
| Verpackungseinheit | 20,0 kg |
|---|---|
| Gebindegröße | |
| Bleihaltig / Bleifrei | bleifrei |
| Legierung |