Description
General lead-free soldering in electronics (refill tin in solder pots), tin-coating and form casting.


high-purity quality from first melting
General lead-free soldering in electronics (refill tin in solder pots), tin-coating and form casting.
| Verpackungseinheit | 20,0 kg, 25,0 kg |
|---|---|
| Gebindegröße | |
| Bleihaltig / Bleifrei | bleifrei |
| Legierung |