Description
Silver brazing alloy with a silver content of 49 % and additives of Ni and Mn, especially for brazing hard metal, chrome, tantalum, tungsten and molybdenum materials. It is a low-melting solder which has a stress-reducing effect due to the greatly differing expansion coefficients of the hard metal and steel materials. Bare solder material is soldered in conjunction with a flux type FH 12 according to DIN EN 18496 (‘CuFe No. 1 – Special’).