SMD solder paste ISO-Cream® “Clear-LOW” Sn95.5Ag3.8Cu0.7

Name: SMD solder paste ISO-Cream® "Clear-LOW" Sn95.5Ag3.8Cu0.7
SKU: 238452018860

lead free no-clean SMD solder paste based on resins (REL0)

Gebindegröße

Korngröße

Inquiry quantity

SKU: 238452018860 Category: Alle

Description

The lead free SMD solder paste ISO-Cream® ‘’Clear-LOW‘’ is characterised by its clear, descreet flux residues, first-class wetting on all common surfaces, optimum printing and dispensing properties, perfect soldering results in the reflow and vapour phase soldering process and high reliability.

Additional information

Verpackungseinheit	3.0 kg, 30.0 kg, 6.0 kg
Gebindegröße	0.250 kg tin, 0.500 kg tin, 1.000 kg cartridge
Bleihaltig / Bleifrei	lead-free
Halogenfrei / Halogenhaltig	halide-free
Korngröße	type 3 25 – 45 my, type 5 15 – 25 my
Applikation	stencil printing
Legierung	Sn95,5Ag3,8Cu0,7

Product information Safety data sheet