Solder wire “Massiv” Sn100Ni+ REFILL

lead-free solid solder wire SnNi0.06Ge0.01 for selective soldering systems with high copper input

kg
SKU: 5514993049 Category:

Description

Description

Solid solder wire for lead-free soldering in selective soldering systems with automatic wire feed. As most PCBs and components have copper-plated circuit tracks and connections, copper is leached into the solder bath during the soldering process. Despite the significantly lower copper alloying when using “Sn100Ni+”, copper can accumulate in the solder bath. We recommend our ISO-Tin® “Sn100Ni+ REFILL” to compensate for this entry of copper in selective soldering systems.

Additional information

Additional information

Verpackungseinheit

24.0 kg

Gebindegröße

Durchmesser

3.000 mm

Bleihaltig / Bleifrei

lead-free

Legierung