Description
Description
For soldering copper materials, as a sealing material against radioactive and electromagnetic radiation or for producing lead lettering.

made of high-purity lead, min. Pb 99.94%
For soldering copper materials, as a sealing material against radioactive and electromagnetic radiation or for producing lead lettering.
| Verpackungseinheit | 10.0 kg, 20.0 kg |
|---|---|
| Gebindegröße | |
| Durchmesser | 0.500 mm, 0.750 mm, 1.000 mm, 1.500 mm, 2.000 mm, 3.000 mm, 4.000 mm, 5.000 mm, 6.000 mm |
| Bleihaltig / Bleifrei | leaded |
| Legierung |