Description
For soldering copper materials, as a sealing material against radioactive and electromagnetic radiation or for producing lead lettering.



made of high-purity lead, min. Pb 99.94%
For soldering copper materials, as a sealing material against radioactive and electromagnetic radiation or for producing lead lettering.
| Verpackungseinheit | 10,0 kg, 20,0 kg |
|---|---|
| Gebindegröße | |
| Durchmesser / Vierkant | 0,500 mm, 0,750 mm, 1,000 mm, 1,500 mm, 2,000 mm, 3,000 mm, 4,000 mm, 5,000 mm, 6,000 mm |
| Bleihaltig / Bleifrei | bleihaltig |
| Legierung |