1,000 kg
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SMD solder paste ISO-Cream® “Clear-LOW” Sn95.5Ag3.8Cu0.7
lead free no-clean SMD solder paste based on resins (REL0) -
Soft solder and tinning paste Pb60Sn40
for hot tin plating copper, copper alloys and steel -
Soft solder and tinning paste Pb74Sn25Sb1
for hot tin plating in odltimer body construction) -
Soft solder and tinning paste Sn60Pb40
for hot tin plating copper, copper alloys and steel -
Soft solder and tinning paste Sn97Cu3
for lead free soldering and tinning (preferably in body construction) -
Solder wire “Massiv” Sn100Ni+
lead-free solid solder wire SnCu0.7Ni0.06Ge0.01 for selective soldering systems -
Solder wire “Massiv” Sn99.3Cu0.7
Lead-free soft solder wire for soldering with separate flux or for filling small solder baths -
Solder wire “Massiv” Pb60Sn40Sb
solid soft solder wire for dip soldering and hand soldering with separate flux -
Solder wire “Massiv” Sn60Pb40Sb
solid soft solder wire for dip soldering and hand soldering with separate flux -
Solder wire ISO-Core “VA”® Sn96,5Ag3,5
flux-filled solder wire for soldering of steel and stainless steel -
Solder wire ISO-Core® “AL” Sn97Cu3
flux-filled solder wire for soldering aluminum -
Solder wire ISO-Core® “Clear” Sn100Ni+
flux-filled, lead-free NiGe electronic solder wire, flux type REL1 -
Solder wire ISO-Core® “Kolo” Sn60Pb40
flux-filled soft solder wire with non activated rosin core (ROL0) -
Solder wire ISO-Core® “Clear” Sn96,5Ag3,0Cu0,5
lead-free, flux-filled, no-clean soft solder wire type REL1 -
Solder wire ISO-Core® “EL” Sn60Pb40E
flux-filled, halogen-free activated soft solder wire (ROL0)