1,000 kg
-
Electronic solder ISO-Tin® Sn62Pb36Ag2
for automated soldering in electronic assembly production -
Electronic solder ISO-Tin® Sn63Pb37E
for automated soldering in electronic assembly production -
Electronic solder ISO-Tin® Sn95.5Ag3.8Cu0.7
for automated soldering in electronic assembly production -
Electronic solder ISO-Tin® Sn96,5Ag3,5
for automated soldering in electronic assembly production -
Electronic solder ISO-Tin® Sn96.5Ag3Cu0.5
for automated soldering in electronic assembly production -
Electronic solder ISO-Tin® Sn96Ag+ High-Ge
lead-free NiGe electronic solder with 3 % silver and increased germanium content (1000 ppm) for wave soldering processes in electronic assembly production -
Electronic solder ISO-Tin® Sn97Ag3
for automated soldering in electronic assembly production -
Electronic solder ISO-Tin® Sn99.3Cu0.7
for automated soldering in electronic assembly production -
Flux powder for silver brazing alloys “CuFe P”
for brazing copper, copper alloys, steel and stainless steel -
Flux paste for silver brazing alloys “CuFe Nr. 1 Spezial”
for brazing cutting metals and CrNi steels -
Flux paste for silver brazing alloys “CuFe Nr. 1”
for brazing copper, copper alloys, steel and stainless steel -
HASL-solder alloy ISO-Tin® SN100-403CLe
copper-free Ni-doped refill solder for hot air solder leveling -
HASL-solder alloy ISO-Tin® SN100-403CLe(+)
copper-free, high Ni-doped refill solder for hot air solder leveling (0,15 % Ni) -
HASL-solder alloy ISO-Tin® SN100-403CLe(+03)
copper-free, high Ni-doped refill solder for hot air solder leveling (0,03 % Ni) -
Pure tin Sn99.9
high-purity quality from first melting