Description
During the soldering process, copper is continuously leached from component contacts and PCB metallisation into the solder bath. The copper content quickly rises above 1% and influences the melting temperature of the solder. The germanium content is also reduced by oxidation. This in turn leads to reduced wetting and affects the soldering performance, especially in selective soldering systems. To compensate for the introduction of copper and the consumption of germanium, we recommend the refill solder ISO-Tin® “Sn95Ag+ High-Ge-REFILL”.