Description
In addition to the well-known advantages of Ni-doped solders, our alloy achieves improved wetting properties and minimal dross formation compared to all other lead-free solders thanks to the addition of silver and germanium. A particular advantage is the low melting temperature of 217 °C and the associated soldering temperature of 260 °C. ISO-Tin® “Sn95Ag+” has a significantly lower copper leaching rate (compared to conventional SnAgCu alloys).