Description
Copper is continuously deposited from component contacts and PCB metallisation during the soldering process. The copper content in the solder bath quickly exceeds 1% and influences the melting temperature of the solder and the soldering performance, especially in selective soldering systems. We recommend using the refill solder ISO-Tin® “Sn96Ag+ REFILL” to compensate the copper content in wave and selective soldering systems filled with Sn96Ag+.