Description
During the soldering process, copper is continuously leached from component contacts and circuit board metallisations into the solder bath. The copper content in the solder quickly rises above 1% and thus influences the melting temperature of the solder. This in turn leads to reduced wetting and can have a negative impact on soldering performance. We recommend the FELDER refill solder ISO-Tin® “Sn99Ag+REFILL” to compensate for the copper content in wave and selective soldering systems filled with “Sn99Ag+”.