HASL-solder alloy ISO-Tin® HAL-Sn99Ag+ REFILL

copper-free NiGe-doped HASL solder with 0.3 % silver for lead free hot plating of pcbs for electronic assembly production

kg
SKU: 5512781026 Category:

Description

In the HASL process, copper is continuously deposited from the PCB metallisation. The copper content in the solder bath quickly exceeds 1% and influences the melting temperature of the solder and the tinning performance. We recommend using our refill solder ISO-Tin® “Sn99Ag+ REFILL” to compensate the copper content in HASL systems filled with Sn99Ag+.

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Verpackungseinheit

20,0 kg
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Bleihaltig / Bleifrei

bleifrei
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