HASL-solder alloy ISO-Tin® SN100-403CLe(+)

copper-free, high Ni-doped refill solder for hot air solder leveling (0,15 % Ni)

kg
SKU: 5612900040 Category:

Description

To compensate the input of copper in hot air solder leveling systems filled with ISO-Tin® “SN100-403CL”, we recommend copper-free refill solder alloys. Particularly in HASL process, the copper input into the solder bath is so high, that nickel is used as a diffusion inhibitor. ISO-Tin®”SN100-403CLe(+)” compensates the increased nickel consumption in the plating bath.

Additional information

Verpackungseinheit

15,0 kg, 20,0 kg
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Bleihaltig / Bleifrei

bleifrei
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