Description
Lead-free tinning of printed circuit boards and copper strips in horizontal and vertical hot tinning systems. In addition to the well-known advantages of Ni-doped solders, our alloy achieves improved wetting properties on copper surfaces in PCB production and minimal dross formation compared to all other lead-free solders thanks to the addition of germanium. A particular advantage is the extremely low copper deposition rate (up to 5 times lower compared to conventional SnCu alloys).