Alle
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Electronic solder ISO-Tin® Sn99Ag+ REFILL
copper-free NiGe-doped electronic solder with 0.3 % silver for lead free wave soldering processes in electronic assembly production -
Fitting solder Cu-Rotin® 3 (Sn97Cu3)
for soft soldering of copper pipes, with RAL quality mark of the Gütegemeinschaft Kupferrohr e.V. -
Fitting solder Cu-Rotin® 4 (Sn97Ag3)
lead free solid wire for soft soldering of copper pipes, with RAL quality mark of the Gütegemeinschaft Kupferrohr e.V. -
Fitting solder paste Cu-Rofix® 3-Spezial (Sn97Cu3)
for pre-tinning and soft soldering in the copper pipe installation -
Fitting solder paste Cu-Rofix® 4-Spezial (Sn97Ag3)
for pre-tinning and soft soldering in the copper pipe installation -
Flux powder for silver brazing alloys “CuFe P”
for brazing copper, copper alloys, steel and stainless steel -
Flux paste for copper and silver brazing alloys “Cu-Rosil”
for brazing copper and copper alloys -
Flux paste for silver brazing alloys “CuFe Nr. 1 Spezial”
for brazing cutting metals and CrNi steels -
Flux paste for silver brazing alloys “CuFe Nr. 1”
for brazing copper, copper alloys, steel and stainless steel -
Flux thinner “VF 1”
for the dilution of electronic fluxes -
Flux thinner “VF 2”
for the dilution of electronic fluxes -
HASL solder alloy ISO-Tin® HAL-Sn100Ni+ REFILL High-Ge
copper-free NiGe-HASL solder with increased germanium content (1000 ppm) for hot air solder leveling -
HASL solder alloy ISO-Tin® HAL-Sn99Ag+ High-Ge
lead-free NiGe-HASL solder with 0.3 % silver and increased germanium content (1000 ppm) for hot air solder leveling -
HASL-solder alloy ISO-Tin® HAL-Sn99Ag+
NiGe-doped HASL solder with 0.3 % silver for lead free hot plating of pcbs for electronic assembly production -
HASL-solder alloy ISO-Tin® HAL-Sn99Ag+ REFILL
copper-free NiGe-doped HASL solder with 0.3 % silver for lead free hot plating of pcbs for electronic assembly production