Alle
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HASL-solder alloy ISO-Tin® SN100-403CL
lead free Ni-doped solder for hot air solder leveling -
HASL-solder alloy ISO-Tin® SN100-403CLe
copper-free Ni-doped refill solder for hot air solder leveling -
HASL-solder alloy ISO-Tin® SN100-403CLe(+)
copper-free, high Ni-doped refill solder for hot air solder leveling (0,15 % Ni) -
HASL-solder alloy ISO-Tin® SN100-403CLe(+03)
copper-free, high Ni-doped refill solder for hot air solder leveling (0,03 % Ni) -
HASL-solder ISO-Tin® HAL-Sn100Ni+
lead free, NiGe-doped SnCu-solder alloy for hot air solder leveling -
HASL-solder ISO-Tin® HAL-Sn100Ni+ REFILL
NiGe-doped refill solder alloy for hot air solder leveling -
High temperature solder Pb93Sn5Ag2
for tinning of copper varnished wires at temperatures up to 570°C -
High-temperature solder Sn95Cu5
lead free alloy for use in selective and dip soldering systems at high soldering temperatures starting at 350 ° C -
High-temperature solder Sn96Cu4Ni
lead free alloy for use in selective and dip soldering systems at high soldering temperatures starting at 350 ° C -
Nickel concentrate “Ni3” (Sn97Ni3)
for setting the optimal concentration of nickel In NiGe-solder-baths -
Nickel-silver brazing alloy
bare brazing alloy for brazing steel, malleable cast iron, cast iron, nickel and nickel alloys -
Nickel-silver brazing alloy “UM”
flux coated brazing alloy for brazing steel, malleable cast iron, cast iron, nickel and nickel alloys -
Pure tin cones Sn99.9
high-purity quality from first melting -
Pure tin Sn99.9
high-purity quality from first melting -
Rework-Flux ISO-Flux “Active-Clear”
No-clean flux with REL1 classification for repair and rework in SMD production