Description
Copper-free solder for refilling of existing lead-free solder baths filled with ISO-Tin® “HAL-Sn100Ni+”. Besides the known advantages of Ni-endowed solder, by adding germanium our alloy achieves improved wetting properties and minimal dross formation compared to all other lead-free HASL solders. A particular advantage is the extremly low dealloyinig rate of copper (compared to common SnCu alloys up to 5 times lower).