Description
Lead-free solid solder wire for selective soldering systems with automatic wire feed in electronic assembly production. In addition to the well-known advantages of Ni-doped SnCu solders, this alloy achieves improved wetting and minimal dross formation thanks to the addition of germanium. In addition, the 0.3 % Ag content leads to a reduction in the working temperature and improved through hole filling. This solder does not contain phosphorus and can be used without limitations in all wave soldering systems.