0.400 kg
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Electronic solder ISO-Tin® Sn98Ag+ High-Ge-REFILL
copper-free NiGe refill solder with 1.2 % silver and increased germanium content (1000 ppm) for wave soldering processes in electronic assembly production -
Electronic solder ISO-Tin® Sn98Ag+ REFILL
copper-free NiGe refill solder with 1.2 % silver for wave soldering processes in electronic assembly production -
Electronic solder ISO-Tin® Sn98Ni+
lead-free NiGe-doped electronic solder with 1.2 % silver for wave soldering processes in electronic assembly production -
2product variants
Electronic solder ISO-Tin® Sn99Ag+
lead-free NiGe-doped electronic solder with 0.3 % silver for wave soldering processes in electronic assembly production -
Electronic solder ISO-Tin® Sn99Ag+ High-Ge
lead-free NiGe-doped refill solder with 0.3 % silver and increased germanium content (1000 ppm) for wave soldering processes in electronic assembly production -
Electronic solder ISO-Tin® Sn99Ag+ REFILL
copper-free NiGe-doped electronic solder with 0.3 % silver for lead free wave soldering processes in electronic assembly production -
HASL solder alloy ISO-Tin® HAL-Sn100Ni+ REFILL High-Ge
copper-free NiGe-HASL solder with increased germanium content (1000 ppm) for hot air solder leveling -
HASL solder alloy ISO-Tin® HAL-Sn99Ag+ High-Ge
lead-free NiGe-HASL solder with 0.3 % silver and increased germanium content (1000 ppm) for hot air solder leveling -
HASL-solder alloy ISO-Tin® HAL-Sn99Ag+
NiGe-doped HASL solder with 0.3 % silver for lead free hot plating of pcbs for electronic assembly production -
HASL-solder alloy ISO-Tin® HAL-Sn99Ag+ REFILL
copper-free NiGe-doped HASL solder with 0.3 % silver for lead free hot plating of pcbs for electronic assembly production -
HASL-solder ISO-Tin® HAL-Sn100Ni+
lead free, NiGe-doped SnCu-solder alloy for hot air solder leveling -
HASL-solder ISO-Tin® HAL-Sn100Ni+ REFILL
NiGe-doped refill solder alloy for hot air solder leveling